This week the Official Gazette noticed four inter partes reexamination requests. Vascular Solutions filed two requests against AngioDynamics’ patents on endovascular treatment devices and methods having a fiber tip spacer. Samsung Electro-Mechanics filed a request against Murata Manufacturing’s patent on an electronic multilayer ceramic component. Well Shin Technology filed a request against Trident Design’s patent on an ejectable electrical connector and method of use.

Requests for reexamination were noticed in the USPTO Official Gazette, captioned below. Notice of Filing of Request for Reexamination means that a request for reexamination has been filed, accorded a filing date, and published in the Official Gazette (MPEP 2215).

Control Number: 95/000,508

Patent Number: 6,716,044
Technology Area: Electrical connectors
Patent Owner: Trident Design, LLC., Columbus, OH
Requester: Well Shin Technology Co., LTD
Firm Requesting: Lin & Associates Intellectual Property, Inc., Saratoga, CA
Date Requested: 11/17/2009
Invention Title: EJECTABLE ELECTRICAL CONNECTOR AND METHOD OF USE

Control Number: 95/001,256

Patent Number: 7,273,478
Technology Area: Surgery
Patent Owner: AngioDynamics, Queensbury, NY
Requester: Vascular Solutions, Inc.
Firm Requesting: Patterson Thuente Skaar & Christensen, PA, Minneapolis, MN
Date Requested: 11/6/2009
Invention Title: ENDOVASCULAR TREATMENT DEVICE HAVING A FIBER TIP SPACER

Control Number: 95/001,257

Patent Number: 7,559,329
Technology Area: Surgery
Patent Owner: AngioDynamics, Queensbury, NY
Requester: Vascular Solutions, Inc.
Firm Requesting: Patterson Thuente Skaar & Christensen, PA, Minneapolis, MN
Date Requested: 11/16/2009
Invention Title: METHOD OF TREATING A BLOOD VESSEL WITH AN OPTICAL FIBER HAVING A SPACER

Control Number: 95/001,267

Patent Number: 6,377,439
Technology Area: Electricity: electrical systems and devices
Patent Owner: Murata Manufacturing Co., LTD., Japan
Requester: Samsung Electro-Mechanics Co., LTD.
Firm Requesting: O’Melveny & Myers, LLP., Newport Beach, CA
Date Requested: 11/18/2009
Invention Title: ELECTRONIC MULTILAYER CERAMIC COMPONENT